“波峰焊接工艺”是一种低成本的加工流程，把电子元件焊接到电路板上。这种工艺的最新发展是采用无铅工艺技术。在波峰焊过程中产品需要经过高温的焊锡槽，这就对通过粘接剂粘附在线路板上的元件的粘接力提出了更高的要求。
使用Openair®等离子技术，对电子元件的表面和芯片的表面进行表面活化处理，可以显著提高粘合力，为其在焊锡槽中进行进一步的加工做好准备。
Plasmatreat goes virtual and is present at the 2nd Virtual Battery Exhibition from VDMA battery manufacturing, which will take place online from April 27 to May 3. On its virtual booth the company will present highlights about its own developed and patented Openair-Plasma technology for surface treatment especially for battery manufacturing.
