Extreme demands on materials and connections
Our solution for typical power pain points
Comparison with competitive processes—Why Plasmatreat is superior
Other cleaning processes such as wet chemistry, vacuum procedures, or mechanical methods face key limitations. Wet chemical cleaning removes thick oxide layers but needs chemicals, complex rinsing steps, and causes environmental pollution. Vacuum processes are mostly batch operations, use a lot of energy, and are difficult to automate. Mechanical techniques like brushing risk leaving particles and aren't reliable for inline quality.
Plasmatreat sets new standards: Openair-Plasma® and REDOX® tools deliver fully automated, physical, chemical-free cleaning in-line that outperforms conventional processes. These methods reliably remove even tough oxide layers, prepare large or complex parts, and, with PlasmaPlus®, form a protective nano-barrier against moisture, migration, and aging.
Plasmatreat offers maximum process integration, scalability, and sustainability—without compromise.
Plasmatreat的Openair-Plasma®等离子技术如何实现清洁和活化效果
提高附着力和粘合力
在使用烧结工艺时，零件的温度会更高，就可能会导致分层问题。Plasmatreat提出了一种创新的组合解决方案，首先用REDOX®-Tool氧化还原系统去除氧化层，然后镀上纳米涂层，确保与模具材料的良好结合。
使用REDOX®-Tool进行氧化还原处理
REDOX®-Tool系统的设计概念是在通道中结合使用混合气体，以实现无助焊剂生产。该技术为后续工艺提供了一个洁净的表面。通过使用REDOX®-Tool系统去除氧化层，提高了材料导电性和可靠性。 这对于功率模块和IGBT等高性能电子元件至关重要。
可连续且高效的处理工艺
REDOX®-Tool系统支持在线集成，可在材料通过生产线时对其进行连续处理。不仅可以减少停机时间，提高整体生产量，还能确保对每个部件进行连续的工艺控制，从而实现稳定的质量和性能。
减少缺陷，提高良品率
彻底的清洁和氧化还原工艺最大程度地降低了出现空洞和其他缺陷的风险，这对大功率电子产品的长期可靠性和性能至关重要。更洁净的表面和更好的粘接性减少了缺陷和返工，从而提高了良品率，确保成品品质。
环保和成本效益
通过最大限度地减少对化学助焊剂和清洁剂的依赖，Plasmatreat解决方案可减少制造过程对环境的影响。工艺效率的提高、产量的增加和耗材用量的减少都有助于降本增效。
应对工艺挑战
Openair-Plasma®等离子技术和REDOX®-Tool在线氧化还原等技术可以有效地清洁和预处理表面，确保所有材料即使在电子产品的高工艺要求下也能正常粘合并可靠运行。
该技术能改善电气性能，提高成品率，并增强元件的整体可靠性和使用寿命。
Industry-specific practical scenarios
Our solution: Precise surface treatment for reliable power modules
Plasmatreat’s Openair-Plasma® technology and the REDOX®-Tool provide advanced inline cleaning and oxide reduction that ensure optimal adhesion and reliable performance—even for demanding applications.
Oxide layers and weak adhesion are thoroughly eliminated, resulting in clean, defect-free surfaces.This leads to improved conductivity for power modules and semiconductors, higher yield rates, and less rework due to consistently clean processes. Durable adhesion and material compatibility maximize product reliability and service life, especially under tough conditions.
With Plasmatreat, manufacturers can count on best-in-class results for next-generation high-performance electronics—delivering superior electrical properties and long-lasting quality.
